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Materials that offers thermal conductivity or isolation depending on the requirements. For thermal conductivity, application conditions determine the type of materials such as gap fillers, grease, adhesives. For thermal isolation RTV sealants will be the choice. Long-term, reliable protection of sensitive electronic components is essential to many applications today. Increasingly small systems and rising circuit densities have resulted in higher operating temperatures, and driven demand for high-performance solutions for heat dissipation. Thermally Conductive Silicone Adhesives and Potting Materials SilCool thermally conductive adhesives to help deliver thin bond lines, which contribute to low thermal resistance while providing excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications. SilCool TIA0220 SilCool TIA0220 neutral alkoxy cure adhesive typically cures at room temperature. It is an ideal candidate for applications that require a high level of thermal conductivity, yet cannot employ a heating process for curing. Potential Applications
Snapsil TN3085 SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to lic moisture. It offers primerless adhesion to many substrates. (readmore) Typical Applications - Bonding in power supplies - Thermal adhesive between electronic components and heat sinks - Securing PCBs to substrates Product Specifications UL94 V-O, File no. E56745 TIA216G TIA216G is a 2-component, thermally conductive potting material. Its low viscosity allows the material to conform to intricate shapes of thermal interfaces and contributes to the reduction of contact interference in complex designs. TIA216G quickly cures to a soft rubber, gel with exposure to heat, and retains tacky adhesion on its cured surface. Potential Applications Thermal potting and gap filling in various electronic components. Thermally Conductive Grease SilCool* TIG1000 Silicone Grease Momentive's SilCool TIG1000 silicone grease is an ideal candidate to consider for applications that require good thermal conductivity, dielectric properties and workability. Potential Applications Hybrid engine parts Board assemblies Flat-panel displays SilCool* TIG210BX SilCool TIG210BX silicone compound from Momentive can provide high thermal conductivity while exhibiting virtually no oil separation and minimal weight loss at elevated temperatures. Potential Applications
THERMAL PROTECTION MATERIALS Momentive’s advanced RTV silicones are able to maintain critical properties for an extended time over the wide range of extreme temperatures typically encountered by aircraft and spacecraft. They remain flexible in extremely low temperatures and are thermally insulative. Our thermal protection systems are available in paste to flowable viscosity. In addition, our aerospace thermal coating systems offer low-outgassing and electrically dissipative formulations to accommodate a wide range of aerospace and defense applications. RTV31, RTV60 and RTV88 RTV31, RTV60 and RTV88 silicone rubber compounds are high temperature two-part silicone elastomers. They are supplied ready-to-use with a base compound and DBT (dibutyl tin dilaurate) as the standard curing agent. Potential Applications
RTV511, RTV560 and RTV577 RTV511, RTV560 and RTV577 silicone rubber compounds are low temperature two-part silicone elastomers. They are supplied ready to use with a base compound and DBT (dibutyl tin dilaurate) as the standard curing agent. Potential Applications
RTV655 RTV655 silicone rubber compounds are clear liquids which cure at room temperature to high strength silicone rubber with the addition of curing agents. Potential Applications Protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards by potting or encapsulation of the components and assemblies.
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